| Program of the National Meeting of Spring 1998 |
3
|
|
| Selection of Optimum Welding Condition and Evaluation of Joint Performance Uning Friction Welding Behaviours―Study on Optimization of Welding Condition and Joint Properties in Friction Welding (2nd Report)― | Koichi OGAWA, Hiroshi YAMAGUCHI, Gosaku KAWAI and Takeshi SAWAI |
18
|
| Effect of Spray Conditions on the Properties of HVOF Sprayed Cr3C2-NiCr Coatings | Keiji SONOYA, Chang-Jiu LI, Gang-Chang JI and Yu-Yue WANG |
25
|
| Eutectic Bonding of Al Pipe to Cu Pipe | Takehiko WATANABE, Hisaya SORITA, Akira SUTOH, Atsushi YANAGISAWA, Osamu OHASHI and Shoichi SATO |
35
|
| Reduction of Blowholes by the Vibration to Molten Pools in Arc Welding of Galvanized Carbon Steel Sheets | Hitoshi MATSUI and Satoshi SHIONOYA |
45
|
| Shear Property of Solders for Flip Chip Joining | Ikuo SHIOHJI, Yasumitsu ORII and Kojiro. F. KOBAYASHI |
51
|
| Strength Characteristics on the Diffusion Bonded Joint of Intermetallic Compound TiAl and Structural Steel | Sachio SETO, Koji MATSUMOTO, Tomomasa MASUYAMA, Misa HIROSHIMA and Hirotoshi ISHIKAWA |
59
|
| Bonding Force of Spatter and Their Influential Factors
―Research on Spatter Caused by Arc Welding (Report 2)― |
Kouichi TANAKA, Yoshihiro INOSE, Susumu IDA, Nobuhiko NISHIWAKI and Sankei HORI |
66
|
| High Temperature Oxidation Behavior of Laser Clad NiCrAlY Layer | Hiroyuki IWAMOTO, Kouichi NISHIDA, Taisuke ASANO, Takashi SUMIKAWA, Minoru NISHIDA and Takao Araki |
74
|
| Characteristics of Residual Stress Produced by MoSi2 Plasma Thermal Spraying and Its Production Mechanism | You Chul KIM, Kyong Ho CHANG and Kohsuke HORIKAWA |
82
|
| Tensile Deformation Behavior of Sn-Ag-Bi System Lead-free Solders | Tadashi TAKEMOTO, Masahiro TAKAHASHI, Akira MATSUNAWA, Ryuji NINOMIYA and Hideo TAI |
87
|
| Influence of Surface Cleanness on Ultrasonic Ball Bondability of Au
Wire onto Au, Cu and Al Pads
―Study of Ultrasonic Bonding with Surface Cleaning by Ion Bombardment (Report 2)― |
Ryoichi KAJIWARA, Toshiyuki TAKAHASHI, Kunihiro TSUBOSAKI and Hiroshi WATANABE |
93
|
| Brittle Properties of Copper Base Lead Frame at Soldered Joint | Takashi Haramaki, Mitsuo Nakamura and Mamoru MITA |
105
|
| Symposium |
110
|